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Technology capability

Technology capability
Capability Line card Backplane Server HDI Rigid-flext board
Layer 2-40 2-56 20-40 4-30 4-20
Board thickness (mm) 0.3-5.0 1.0-10 2.5-5.7 0.4-4.0 0.4-3.0
Board size (mmXmm) 600×1180 600×1180 785*475 610×475 580×420mm
Copper thickness of inner layers  (OZ) T-5 H-5 H-5 H-4 T-1
Hole wall thickness (µm) 20-70 20/18,  25/20 20/18,  25/20, 25/28 20/18,  25/20 20/18,20/25
Finish copper thickness of outer layers  (OZ) 1-5 1-5 1-5 1-2 1-2
PCB types Lead free (mid and high Tg), halogen-free, high frequency (hybrid, PTFE, etc.), high speed (mid loss, low loss, very low loss, ultra low loss,etc.), PI, buried capacitance, buried resistance
Trace width/spacing of inner layer  (mil) 2.4/2.4 3/3.5 3/3 1.6/1.6 1.6/1.6
Trace width/spacing of outer layer  (mil) 3/3 4/5 3/4 3/3 3/3
Mini. Drill bit  (mm) ≥0.15 ≥0.2 ≥0.2 ≥0.15 ≥0.15
Laser hole size  (mm) ≥0.075 / / ≥0.075 ≥0.075
PTH hole aspect ratio  (max.) 40/1 40/1 30/1 25/1 25/1
Surface treatment Lead free HASL, ENIG, Immersion Tin, Immersion Ag, Gold finger, OSP+ENIG
Structure Through-hole, 3+N+3 / 3+N+3 3+N(N+M)+3
NR-2F-NR
2F-NR
NR-4F-NR(PP bonding)
Air gap(2 cavities)

Special products
Embedded PCB Buried capacitance, Buried resistance, Embedded daughter board, Embedded magnetic cores. Etc
Step board PTH step board, NPTH step board, step gold finger board, graph in bottom of step
Heat dissipation board Post bonding, Sweat soldering, embedded coin, embedded ceramic
High density board 2 trace through 0.9mm BGA pitch(one hole back drill), 6mil through hole backdrill(D+6), high depth laser hole, (AR=0.8)0.65mm BGA pitch
Other special board POFV (VIPPO), hybrid, local hybrid, long-short gold finger, Plating side of board, N + N structure, double side press fit hole, thick copper, etc